WEP AT858D (110V) Hot Air Rework Soldering Station, Suitable For SMD, SOIC, CHIP, QFP, PLCC, BGA

WEP AT858D (110V) Hot Air Rework Soldering Station, Suitable For SMD, SOIC, CHIP, QFP, PLCC, BGA Review

WEP AT858D (110V) Hot Air Rework Soldering Station, Suitable For SMD, SOIC, CHIP, QFP, PLCC, BGA Feature

• High Efficient, Space Saving and Extremely Low Noise, Enhanced Temperature Stability
• Comfortable Portable Handheld Hot Air Gun,Build-in Microcomputer Control, Warning-Up Quickly
• Digital L.E.D Screen for Hot Air Gun Precision Temperature Displays
• Alloy Metal Body with High Quality Silicone Shell for Extended Life and Power Saving
• Attention: Works under 110V Voltage, comes with 3 types of nozzles

WEP AT858D (110V Version),same as Atten AT858D, has exquisite dimensions and many excellent features.

Airflow is strong and mild but with low noise.
Temperature is very easy and convenient to adjust through the knobs. T
Very energy-saving .The hot gun has PIR sensor. Once it's hold, AT858D will go to work mode soon. And once hand off, it will go back to rest mode.
Ideal for safe demolition solder QFP, PLCC, SOP, BGA and other chips and components which are temperature-sensitive.